Advanced Packaging Integration Engineer
Applied MaterialsSanta Clara, California, United States
Posted March 19, 2026
176000 - 242000 USD
Full Time
About the Company
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
Job Description
Apply to join Applied Materials as an Advanced Packaging Integration Engineer. Develop and optimize advanced packaging process integration flows, collaborate with cross-functional teams, and drive innovative solutions for customers.
Requirements
- M.S. or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM discipline.
- In-depth knowledge and hands-on experience in advanced packaging technologies, including wafer-to-wafer or die-to-waer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes.
- Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.
- Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP). Coding experience is a plus.
- Experience with MES systems is a plus.
- Ability to prepare clear, compelling executive-level or customer-facing presentations is a plus.
- Self-starter with strong problem-solving skills; able to work both independently and in team environments with minimal supervision.
Benefits
- Comprehensive benefits package
- Bonus program
- Stock award program
