We are seeking a Process Integration Engineer to join our global diverse cross-functional team responsible for developing new modules in Advanced Semiconductor Packaging. The successful candidate will be in Santa Clara, CA or Albany NY and will be responsible for developing new modules leveraging Applied's wide equipment portfolio and helping advise the packaging Business Unit on equipment requirements for Advanced semiconductor packaging.
Requirements
- Developing new modules leveraging Applied's wide equipment portfolio and help advice the packaging Business Unit on equipment requirements for Advanced semiconductor packaging.
- File for IP on new patentable developments
- Domain expertise in advanced packaging areas such as W2W/D2W bonding, micro bumps, TSV, thermal management, optics and multi-wafer stacking with deep understanding of materials, process, device physics and integration.
- Ability to drive new materials and process development to enable new inflections in logic, DRAM and NAND through structured problem-solving methodology.
- Proven track record of solving complex problems through innovation and ideation of novel approaches.
- Act as engineering expert in semiconductor packaging and help drive cross-functional projects by working with engineers, managers and directors/Senior directors across Applied's business units, including the packaging business unit.
- Help structure and maintain Applied's roadmap in Packaging modules and how it fits within advanced modules with the industry.
- Help design experiments to help improve packaging wiring to improve performance, by reducing RC delays and increasing wiring density in various dielectrics, including polymer dielectrics and deposited thin film dielectrics.
- Represent Integration Module Solutions (IMS) as a module specialist to various business units within Applied and to customers, outside Applied.
- Define engineering plans, design DOEs, help characterize and create engineering reports for advanced packaging.
- Create roadmap committees for some packaging applications and help shepherd Applied's product portfolio.
- Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
- 10 years of experience in semiconductor packaging development and manufacturing
- Strong communication skills to be effective in dealing with Business Units, cross-functional teams, internal or external manufacturing and customer
- Lead project across organization and culture in a fast-paced environment
- Self-starter, team player and able to work independently with minimal supervision
- Business Expertise
- Applies broad industry and commercial awareness to drive financial and operational performance across business unit, department or sub-functions
- Leadership
- Leads through influence, knowledge and connections; Operates with managers from both within and outside the immediate business unit she/he will be a part of; executes segment/functional business plans and contributes to the development of segment/functional strategy
- Problem Solving
- Directs the resolution of highly complex or unusual business problems applying advanced analytical thought and judgment
- Impact
- Guided by segment/functional strategy, impacts results of a department, business unit or sub-function or facilitates the work done by other segments/functions by providing support to impact the business
- Interpersonal Skills
- Negotiates and influences the opinions of others at the senior executive level and in external organizations; exercises sensitivity to the audience
- Position requires understanding of Applied Materials global Standards of Business Conduct and compliance with these standards at all times.
Benefits
- Comprehensive benefits package
- Participation in a bonus program
- Participation in a stock award program
