Substrate IC Package Layout Design Engineer

As a Substrate IC Package Layout Design Engineer at Etched, you will be responsible for designing complex IC substrate packages for high-power AI processors and accelerators, with a focus on optimization for power delivery. The ideal candidate will have extensive experience with large substrate designs, complex power delivery networks, and high-speed signaling solutions.

Requirements

• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field.
• 10+ years of experience in IC substrate layout design for high-performance processors or accelerators.
• Advanced proficiency in Allegro Package Designer (including constraint management, routing, and design verification).

Benefits

• Full medical, dental, and vision packages, with 100% of premium covered
• Housing subsidy of $2,000/month for those living within walking distance of the office
• Daily lunch and dinner in our office
• Relocation support for those moving to Cupertino