Package, Assembly, Test (PAT) Team Lead

We are seeking an experienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leader with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.

Requirements

• Lead Asia operation team working with OSATs, assembly houses, PCBA lines to support NPI and volume production.
• Working closely with HQ RnD and operation team to implement wafer level probe tests at OSATs to identify known good dies.
• Working with HQ team to support device packaging process improvement with Cp and Cpk increase.
• Manage and expand the Asia operation team when needed.

Benefits

• Competitive salary and equity
• Comprehensive medical, dental, and vision coverage
• 401(k) retirement plan
• Flexible vacation and time-off policy
• Collaborative, fast-paced, and inclusive work environment