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Job description
The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions.
As an Advanced Packaging Design engineer, responsibilities include understanding of substrate or PCB design tools such as APD or Xpedition to generate advanced packaging solutions, along with knowledge of floor-planning and architectural considerations surrounding the routing of various interfaces through package substrates and interposers.
The ideal candidate will possess a bachelor's degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with 3+ years of professional experience.
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Company
Tech, Software & IT Services
Marvell is a global semiconductor company that designs and manufactures advanced infrastructure solutions for connectivity, storage, and data center workloads. Its portfolio spans wireless and wired connectivity, enterprise and consumer solutions, cloud infrastructure, and high-performance storage. Marvell differentiates itself through an end-to-end design approach that integrates silicon, software, and services, enabling partners to accelerate product development and achieve superior performance. The company emphasizes collaborative engineering, agile partnerships, and a culture that prioritizes execution and innovation, fostering a workplace where employees collaborate closely with customers to deliver tailored solutions.