
Job description
The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions.
This engineer will be responsible for leading small project teams of design and simulation engineers to deliver innovative high quality packaging solutions.
Experience in substrate and/or board design for package technologies with basic understanding of design for manufacturing and reliability as well as electrical performance and the ability to make trade off decisions accordingly.
Company
Keep exploring
Sign in to see similar jobs
Create a free account to discover roles related to this posting.

Tech, Software & IT Services
Marvell is a global semiconductor company that designs and manufactures advanced infrastructure solutions for connectivity, storage, and data center workloads. Its portfolio spans wireless and wired connectivity, enterprise and consumer solutions, cloud infrastructure, and high-performance storage. Marvell differentiates itself through an end-to-end design approach that integrates silicon, software, and services, enabling partners to accelerate product development and achieve superior performance. The company emphasizes collaborative engineering, agile partnerships, and a culture that prioritizes execution and innovation, fostering a workplace where employees collaborate closely with customers to deliver tailored solutions.