Power Integrity Engineer - Advanced Packaging

Role Overview

The Marvell - Central Engineering Packaging organization drives semiconductor IC package development from concept to mass production and is responsible for supporting customers with advanced custom package designs that meet challenging electrical requirements.

What You Will Do

You will be responsible for package development, electrical design, modeling, and characterization of advanced packaging PDN, focusing on power integrity optimization while considering manufacturing and assembly tolerances.

Why It Might Be a Fit

Must have strong teamwork skills, as well as strong communication, presentation, and documentation skills. Good English knowledge both verbal and written.

Requirements

• Bachelor’s degree in Electrical Engineering
• 3 - 5 years of related professional experience
• Strong fundamentals in electrical circuits theory, electromagnetics (EM), transmission lines and microwave theory, Signal and Power Integrity
• Experience in using 2-D and 3-D EM simulation tools
• Frequency domain and time domain knowledge of high speed signaling
• Experience with channel simulations using MATLAB, ADS or other tools
• Power plane design, modeling and analysis for Power Integrity
• Familiarity with IC package or PCB layout tools
• Experience with 2.5D/3D package development
• Working knowledge of circuit design tools
• Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
• Track record of new product introduction from concept, through development and production
• Knowledge of the thermal and mechanical analysis of the IC package development
• Ability to automate the SI, PI and Packaging activities using scripting tools

Benefits

• Competitive compensation
• Great benefits
• Workstyle within an environment of shared collaboration, transparency, and inclusivity
• Tools and resources to succeed in doing work that matters
• Opportunities for growth and development