Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND

Join an inclusive team passionate about using their expertise in the relentless pursuit of innovation for customers and partners. As a Principal Engineer, you will provide technical leadership for NAND Advanced Thin Films, defining technical direction and driving strategic advancement and integration of sophisticated structural and electrical film processes into manufacturing.

Requirements

• PhD ≥5 yrs, or Master’s ≥7 yrs, or Bachelor’s ≥10 yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field
• Mastery of thin film deposition (ALD/CVD) for high-density NAND applications; process design/optimization/integration
• Advanced characterization capability (examples cited: XRR, ellipsometry, SEM, TEM, SIMS, XPS) and electrical evaluation methods (leakage/impedance/capacitance/breakdown)
• Proficiency in SPC/DOE/data analytics for optimization and fixing
• Ability to drive novel chemistries/materials/hardware solutions (e.g., chamber design, plasma source optimization, gas delivery)
• Technical leadership through influence; strong cross-functional and cross-site collaboration
• Mentorship and clear executive-ready technical communication
• Highly Desirable / Preferred: Competitive benchmarking / industry trend assessment translating into actionable roadmaps
• Embody Micron’s core values: People – Respect, develop and empower others, Innovation – Drive continuous improvement and breakthrough thinking, Tenacity – Show grit and determination, Collaboration – Build trust and foster teamwork, Customer Focus – Deliver excellence and value