Lead process technology transfers, develop production processes, and provide engineering support to facilitate production processes and troubleshoot problems in assembly areas.
Requirements
- BSME or equivalent 4 year technical degree or 4-6 years of combined education and experience
- 3 years of related manufacturing experience
- CAD, Solid works software courses, and/or experience
- PADS, CAM350 software knowledge is a plus
- Fast technical document generation/modification CAD, Excel, (PCB software is a plus)
- Design tool/fixtures with minimal guidance
- Knowledge of Mil-PRF-38535 / Mil-PRF-38534 in military standards a plus
- Knowledge of Mil-STD-883 / Mil-STD-750 in test methods with related equipment (wire bond, die attach, & furnace) a plus
- Knowledge or experience with Automatic assembly equipment for Wire bond, Die attach a plus
- Knowledge in semiconductor manufacturing a plus
Benefits
- Medical
- HSA and FSA plans
- Dental
- Vision
- Company paid basic Life Insurance
- Employee Assistance Program (EAP)
- 401k with employer match
- Paid leave
- Vacation
- Holidays
- Generous tuition assistance
- 529 College Savings
- Pet insurance
- Legal insurance
- Well-being programs
