The Postdoctoral Fellow position at The University of Texas at Austin is to advance research in microelectronics thermal management and advanced packaging. Aiming to develop early-career researchers by engaging them in both applied and fundamental research. Fellows will collaborate with a team of engineers and scientists on cutting-edge advancements in heterogeneous integration.
Requirements
- A PhD received within the last 3 years in Mechanical Engineering or a closely related discipline with a focus on heat/mass transfer, fluid mechanics, and interfacial sciences.
- Experience with experiments and modeling (traditional CFD modeling).
- Experience with finite element analysis and/or software packages like Comsol or ANSYS.
- Familiarity with microelectronics packaging and heterogeneous integration is a big plus.
- Familiarity with reliability characterization is a plus.
Benefits
- Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
- Voluntary Vision, Dental, Life, and Disability insurance options
- Generous paid vacation, sick time, and holidays
- Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
- Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
- Flexible spending account options for medical and childcare expenses
- Robust free training access through LinkedIn Learning plus professional conference opportunities
- Tuition assistance
- Expansive employee discount program including athletic tickets
- Free access to UT Austin's libraries and museums with staff ID card
- Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
