
Job description
As a Dry Etch Principal Process Development Engineer, you will advance and improve plasma dry etch processes for the forthcoming generation of Micron's memory parts. You will guide ideas from conception, through process development, all the way to integration in our production facilities. You will work in a highly collaborative atmosphere and interact with groups like process integration, electrical failure analysis, yield improvement, manufacturing, and equipment engineers.
Develop and refine dry etch processes for advanced DRAM structures, collaborate with process integration and other process development teams, perform root cause and failure mode analysis, design experiments and analyze data to improve capability and yield, support process transfer from development to manufacturing.
You will grow into an expert engineer and lead dry etch technology roadmaps, directly influencing Micron’s global leadership in semiconductor manufacturing. You will have the opportunity to work across teams and communicate technical results clearly.
Company

Manufacturing
Micron Technology is a global leader in semiconductor memory and storage solutions, delivering high-performance DRAM, NAND, NOR flash, SSDs, and advanced Hybrid Memory Cube and multichip packages under its Micron and Crucial brands. The company’s focus on customer-centric design, cutting-edge technology, and manufacturing excellence enables it to power a wide range of compute-intensive applications—from large-scale data centers to the intelligent edge, and from client PCs to mobile devices. Micron’s continuous innovation fuels the data economy, supporting artificial intelligence, machine learning, and high-throughput analytics. Its reputation for reliability and performance, combined with a strong culture of engineering excellence, distinguishes Micron as the preferred partner for organizations seeking next-generation memory and storage solutions.
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