2026 Intern - Packaging Engineer

This position is a packaging front-end R&D intern, focusing on IC packaging technology research and development, and will work with a global team to finish development projects.

Requirements

• New packaging technology development
• New package related process development
• Advanced material interface study
• Advanced IC package failure analysis
• Coordinate/lead development project independently
• Communication/cooperation among global teams

Benefits

• More information about NXP in Greater China