
Job description
As a Senior Process Engineer, you will be the technical owner of the Electro‐Chemical Plating (ECP) copper process on the LAM Novellus SABRE platform. You will drive process development and sustaining activities, working closely with equipment engineering to characterize hardware, resolve complex issues, and continuously improve process robustness, yield, and overall tool performance.
Develop, optimize, and sustain ECP Cu reinforcement / damascene fill processes on Novellus SABRE tools. Define and tune recipes and hardware configurations to achieve target thickness, uniformity, fill performance, and defect levels.
You will collaborate with PVD barrier/seed and integration teams to ensure strong linkage between upstream processes and downstream ECP performance. You will lead troubleshooting and excursion management, conduct systematic root‐cause analysis, and implement permanent corrective and preventive actions.
Company

Manufacturing • Tech, Software & IT Services
STMicroelectronics is a global leader in the semiconductor industry, designing, developing, and manufacturing intelligent and energy-efficient solutions for a wide range of applications. The company’s diverse portfolio includes MEMS and sensors, smart power technologies, microcontrollers, and silicon carbide products, serving key markets such as automotive, industrial, and consumer electronics. STMicroelectronics empowers innovation by providing the foundational technology for smarter, more connected devices. They partner with customers to advance solutions in areas like smart driving, smart factories, and the Internet of Things, focusing on enhancing performance and efficiency. This makes STMicroelectronics a compelling organization for engineers and professionals seeking to contribute to cutting-edge technological advancements with real-world impact.
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