Customized Memory Solution Product Engineer

At Winbond, learning has no limits, and AI technology synchronization with your future growth! We provide a comprehensive data application learning resource, combining data presentation, data processing, process automation, and AI assistants. Join Winbond as a Customized Memory Solution Product Engineer.

Requirements

• Master's degree in Electrical Engineering and Electronics Engineering-related or Materials Engineering-related
• Familiarity with semiconductor processes
• Engineering communication/analysis ability
• 3D packaging and stacking engineering analysis ability
• DRAM process development experience is desirable

Benefits

• Incentive system: Winbond Star Award, Special Award, Operational Performance Award, Employee Remuneration, Incentive Fund, Patent Award
• Group insurance: comprehensive medical insurance system, including regular life insurance, accidental insurance, inpatient medical insurance, and cancer insurance
• Vacation system: better-than-labor standard leave system
• Childcare allowance: supporting employees with better care for newborn children