Microelectronics Assembly Technician

Assemble complex microelectronic hybrid circuits based on thick and thin film substrates populated with wire bonded die and surface mounted components, utilizing microelectronic hybrid assembly techniques and equipment.

Requirements

• High school diploma or equivalent required
• 2–3 years of experience in microelectronic hybrid circuit assembly
• Hands-on expertise with thick and thin film substrate technologies
• Proficiency in assembly techniques: Wire bonding, Eutectic die attach, Solder reflow, Epoxy attach, Gap welding and hermetic sealing

Benefits

• Retirement Plan
• Generous Paid Time Off
• 401k Matching