IC Packaging Technologist

We are seeking an experienced IC Packaging Technologist to lead and innovate in the development of high-performance, high-speed, and advanced IC package solutions.

Requirements

• M.S. or Ph.D. in Electrical Engineering, Materials Science, or related discipline
• 10 years of experience in IC packaging development with deep exposure to SIPI and 2.5D/3D integration technologies
• Hands-on experience with CoWoS, interposers, WLP, chiplet-based integration
• Proficiency in SIPI tools: HFSS, Siwave, ADS, HSPICE, etc.
• Hands-on experience in high-frequency measurement and characterization with such as VNA
• Expert knowledge of EDA design tools: Cadence Allegro/APD, Altium, etc.
• Entrepreneurial, open-mind behavior and hands-on work ethic with the ability to prioritize a dynamic list of multiple tasks

Benefits

• Proven experience in end-to-end IC packaging development for advanced packaging
• Experience in high-speed SerDes IC package development
• Strong background in package SIPI for ultra-high-speed interfaces
• Demonstrated success leading die-package-board co-design efforts
• Hands-on lab validation experience and simulation-correlation with high-frequency measurement
• Extensive engagement with foundries, OSATs, and substrate suppliers for collaborative package technology development
• Deep understanding of the technology landscape, cost drivers, and market trends influencing IC packaging innovation
• Demonstrated ability to operate cross-functionally across design, product/test engineering, operations, reliability, marketing, and customer-facing engineering teams