This opening is for working on chips that enable Physical Layer Products for High Speed Optical Communication. Design, script, and debug IC designs for high-speed optical communication products. Collaborate with teams in remote locations with different time zones.
Requirements
- B.S degree in EE or computer Engineering. Minimum of 5 years of work experience with direct related technical skill
- M.S degree/Ph.D in EE or Computer Engineering with 3 years of work experience
- Good knowledge of ARM subsystem
- Good knowledge of high speed digital circuit design
- Good knowledge of digital upsampling/downsampling
- Good knowledge of 10G/100G/200G/400G/800G Ethernet and OTN network
- Good knowledge on FEC (Forward Error Correction) design
- Good knowledge of digital signal processing and error correction code is a plus
- Strong analytical and problem solving skills as well as hands-on lab debugging experiences
- Good knowledge of RTL simulation and synthesis
- In-depth knowledge for design for low power and design for test and design for manufacturing
- Good Knowledge in languages relevant to the ASIC development process including Verilog, VHDL, Unix/Perl Scripting or Python, and C
- Self-motivated, excellent communication skills and ability to excel in a team environment
- Good organization skills, able to follow through & bring issue to closure
- Understand the entire IC development flow & procedure including silicon volume production qualification requirements & procedures
- Enthusiastic & enjoy IC development works
- Be able to work with teams at remote locations with different time zone
Benefits
- Medical, dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- company paid holidays
- paid sick leave and vacation time
- Paid Family Leave