Lead Design Engineer

We are looking for an experienced lead Analog Design Engineer to drive the design and delivery of high-speed interface IPs, with a strong emphasis on Die-to-Die (D2D) interconnects based on the UCIe standard and advanced package technologies.

Requirements

• Bachelor’s or Master’s degree in Electrical / Electronics Engineering or related field.
• 5+ years of hands-on experience in analog / mixed-signal IC design.
• Strong experience with high-speed interface design (e.g., DDR, PCIe, SerDes, Die-to-Die links).
• Solid understanding of UCIe standard concepts, D2D PHY requirements, and chiplet architectures.
• Experience working with advanced packaging technologies and understanding package-induced effects on high-speed signaling.
• Proficiency in schematic-level design, simulation, and debug across PVT corners.
• Strong fundamentals in analog circuit theory, signal integrity, noise analysis, and clocking.