Optoelectronic IC Package Design Director
CienaNew Jersey, United States
Posted March 13, 2026
235600 - 376400 USD
Full Time
About the Company
Ciena is a technology company that leads with its humanity, prioritizing a people-first approach and fostering an environment where employees feel respected, valued, and heard.
Job Description
As the Optoelectronic IC Package Design Director, you will lead package development for custom in-house photonic, analog, and digital ICs, supporting next generation optical modules. Ciena prioritizes a flexible work environment and values individual growth, well-being, and belonging.
Requirements
- Own and drive advanced package selection, new product BGA configuration, and package structure
- Own and manage package development schedules
- Responsible for package layout, SI/PI optimization, design verification and tapeout
- Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design
- Work cross-functionally, understand trade-offs, constraints, and optimize silicon floor plan, bump and package pin out
- Simulate and optimize signal and power integrity and RF performance of the package design
- Interface and work with CMs and vendors for sourcing existing designs and future product development
Benefits
- Medical, dental, and vision plans
- Participation in 401(K) (USA) & DCPP (Canada) with company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Company-paid holidays
- Paid sick leave
- Vacation time
- Paid Family Leave