Sample Preparation Specialist IV (Chip Assembly & Wire Bonding)

D-Wave is seeking a Sample Preparation Specialist (Chip Assembly & Wire Bonding) to join our Lab Operations team. In this role, you will build and prepare chip samples for cryogenic testing, including mounting chips on copper baseplates, wire bonding to PCB stacks, and soldering delicate connectors.

Requirements

• Mount chips to copper baseplates using approved adhesives, fixtures, and curing processes
• Hand wire bond aluminum connections; operate manual and automated wire bonders as trained
• Micro-solder fine-pitch PCB connectors and jumpers with precision
• Handle, align, and secure parts under a microscope using tweezers, micromanipulators, and torque tools
• Clean samples with approved chemistries (e.g., IPA, acetone, flux removers) and ultrasonic baths as required
• Dismount, package, and store delicate samples for records, shipment, or failure analysis
• Inspect work using microscope visual checks, continuity/resistance tests, basic bond pull/shear checks, and photo documentation
• Record work accurately in travelers, lot and revision tracking, and rework logs
• Maintain tools, fixtures, and workstations in an organized and safe manner
• Contribute to process improvements by updating procedure documentation, introducing jigs/fixtures, and suggesting workflow optimizations
• Collaborate with Lab Operations, Packaging, and Engineering teams on priorities, nonconformances, and design feedback
• Follow established procedures consistently while learning to troubleshoot and optimize workflow steps
• Take ownership of assigned tasks, escalate issues when necessary, and actively seek guidance to build technical knowledge

Benefits

• Generous Paid Time Off
• 401k Matching
• Retirement Plan
• Visa Sponsorship
• Four Day Work Week
• Generous Parental Leave
• Tuition Reimbursement
• Relocation Assistance