Advanced Packaging Yield Analysis and Defect Engineer

Advanced Packaging Technology and Manufacturing (APTM) Yield Group is looking for a Yield Analysis and Defects lead engineer to join our team tasked with the objective of driving yield and defect improvement across APTM portfolio of packaging technologies.

Requirements

• Extract insights from structured and unstructured data by quickly synthesizing large volumes of data, applying statistical methods and machine learning techniques
• Develop solutions to problems by utilizing formal education, knowledge of manufacturing process, statistical knowledge, and problem-solving tools
• Independently drive recommendations and influence the Yield and defects improvement roadmap

Benefits

• Competitive pay
• Stock bonuses
• Health benefits
• Retirement benefits
• Vacation benefits