As a Process Engineer at Lam, you will operate on cutting-edge technology, harnessing atomic precision, material science, and surface engineering to push technical boundaries. Your role involves developing new and advanced process formulations, defining equipment hardware to meet processing requirements, evaluating test data, and coordinating design requirements to ensure compatibility of processing methods.
Requirements
- Ph.D. in Materials Science, Chemical Engineering, Chemistry or Physics or Masters or Bachelors with relevant work experience.
- In-depth understanding of Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP) and Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD).
- Familiarity with working in a laboratory and on semiconductor equipment with experience in surface preparation and analytical techniques.
- Strong organizational skills and demonstrated ability to manage multiple tasks simultaneously and ability to react to shifting priorities to meet business needs and deadlines.
- Excellent people skills with demonstrated ability to work effectively and efficiently with diverse teams, semiconductor customers, internal and external partners.
- Experience working in a collaborative and matrixed environment.
Benefits
- Health, dental, and vision insurance
- 401(k) plan
- Stock options
- Paid time off
- Paid holidays
- Flexible work arrangements