As a Structural/Thermal Modeling Engineer 3, you will develop physics-based models for Thermo-Elastic, Structural, and CFD applications for components in the semiconductor capital equipment industry. You will work on cutting-edge R&D activities, develop methods for translating tool operational data into improved engineering designs, and provide design improvements of in-service tools based on quantitative field measured failure data.
Requirements
- PhD in Mechanical Engineering or closely related field with strong emphasis in solid mechanics, heat transfer, and fluid mechanics or related fields.
- Strong ability and understanding of AI/ML concepts and hybrid physics-based AI/ML modeling software.
- Coding ability to supplement commercial software for specific applications as needs arise.
- Ability to work within a team to own and design concepts and drive design decisions.
- Ability to lead and conduct design reviews in cross-functional and matrixed environments.
- Strong written and oral communication.
- Self-starter to start own initiatives and projects for continuous improvement in capabilities and design.
Benefits
- Comprehensive set of outstanding benefits
- Flexible work location models (On-site Flex and Virtual Flex)
- Opportunity to work remotely