Director, AT Capital and Advanced Packaging Cost
Micron TechnologySingapore, Singapore
Posted February 20, 2026
Full Time
About the Company
Micron Technology is a leading provider of high-performance memory and storage solutions, including DRAM, NAND, NOR flash, SSDs, and hybrid memory cubes. With a focus on innovation and operational excellence, Micron serves the data center, intelligent edge, and client markets, enabling advancements in AI and compute-intensive applications. The company's commitment to technology leadership and customer-centric approach positions it as a key player in the semiconductor industry.
Job Description
Join our inclusive team passionate about innovation and leadership. As Director, AT Capital and Advanced Packaging Cost, you will drive strategic initiatives for Micron's Assembly & Test capital optimization and Advanced Packaging cost competitiveness. You will lead high-impact projects, collaborate with global teams, and influence decision-making at senior levels to deliver best-in-class capital efficiency and cost structure.
Requirements
- Bachelorâs degree in Engineering, Information Systems, Computer Science, or related field; or equivalent industrial engineering experience.
- Minimum of 10 years of experience in the semiconductor industry.
- Demonstrated excellence in leading and mentoring high-performance teams.
- Strong communication skills, with the ability to influence stakeholders across all organizational levels.
- Proven project management expertise with the ability to drive complex, cross-functional programs.
- Strong analytical, interpersonal, and decision-making skills, with the ability to thrive in a dynamic environment.
- Practical knowledge of statistics, data analysis, and structured problem-solving.
- A track record of outstanding performance and leadership capability in prior roles.