Engineer, Advanced Packaging Process and Equipment Technology Development Engineering
Micron TechnologySingapore, Singapore
Posted January 30, 2026
Full Time
About the Company
Micron is an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all.
Job Description
Join Micron's Advanced Packaging Technology Development (APTD) team as an Advanced Packaging Process and Equipment Technology Engineer to develop and enable deployment of assembly processes for advanced packaging technologies.
Requirements
- Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
- Evaluate and promote new equipment and materials to enhance process capabilities.
- Ensure defense coverage through process, measurement, inspection, and testing.
- Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives.
Benefits
- Competitive salary
- Comprehensive benefits package
- Opportunities for professional growth and development