Engineer, APTD CEM - Advanced Packaging Integration Engineering

Join an inclusive team passionate about using expertise in the relentless pursuit of innovation for customers and partners. Our solutions help make virtual reality experiences and breakthroughs in neural networks possible while committing to integrity, sustainability, and community support.

Requirements

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
• Integrate semiconductors while partnering with process and product engineering teams
• Achieve and improve yields through silicon package integration innovation
• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
• Ensure defense coverage through process, measurement, inspection, and testing
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
• Work closely with internal and external stakeholders to build and execute technology development strategies
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

Benefits

• Competitive salary
• Opportunities for professional growth and development
• Collaborative and inclusive work environment
• Comprehensive benefits package
• Flexible work arrangements