Principal HBM Design Architect
Micron TechnologyRichardson, Texas, United States
Posted March 3, 2026
Full Time
About the Company
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence.
Job Description
As a Principal HBM Design Architect, you will design, simulate, and optimize digital and analog DRAM circuits for next-generation high-bandwidth memory products. You will collaborate with a distributed team to deliver highly reliable, industry-leading HBM solutions. This role provides the opportunity to contribute to groundbreaking DRAM design, TSV-based 3D integration, and high-speed mixed-signal architectures supporting Machine Learning and AI applications.
Requirements
- BSEE with 7+ years of relevant engineering experience, or MSEE with 5+ years of relevant engineering experience.
- Strong knowledge of CMOS circuit design and semiconductor device physics.
- Hands-on experience with schematic entry and simulation tools such as Finesim and HSPICE.
- Experience with power distribution and power network analysis.
- Proficiency with scripting languages such as Python, Tcl, or Perl.
Benefits
- Choice of medical, dental and vision plans
- Benefit programs that help protect income if unable to work due to illness or injury
- Paid family leave
- Robust paid time-off program
- Paid holidays