Principal HBM Design Architect
Micron TechnologyRichardson, Texas, United States
Posted March 6, 2026
Full Time
About the Company
Micron Technology is a leading provider of high-performance memory and storage solutions, including DRAM, NAND, NOR flash, SSDs, and hybrid memory cubes. With a focus on innovation and operational excellence, Micron serves the data center, intelligent edge, and client markets, enabling advancements in AI and compute-intensive applications. The company's commitment to technology leadership and customer-centric approach positions it as a key player in the semiconductor industry.
Job Description
Micron Technology is seeking a Principal HBM Design Architect to craft, simulate, optimize, and floorplan digital and analog DRAM circuits used in advanced HBM products.
Requirements
- Design, simulate, and optimize DRAM memory array, data path, ECC, command/control, and high-speed interface circuits
- Evaluate block-level and full-chip functionality and propose solutions to ensure functional correctness
- Analyze timing, area, power, and complexity trade-offs in high-speed DRAM or mixed-signal circuits
- Perform pathfinding and feasibility studies to explore new architectures for future HBM products
- Contribute to the design, layout, and optimization of memory, logic, and analog circuits
- Support verification, debug, and validation activities for large-scale HBM designs
- Work collaboratively across engineering teams involved in vertical integration and TSV-based stacking
- Participate in design reviews and continuous improvement of design methodologies
Benefits
- Choice of medical, dental and vision plans
- Paid family leave
- Paid time-off program
- Paid holidays