Engr Prin, Package Development (NPI Mold Engineer)
onsemiSeremban, Negeri Sembilan, Malaysia
Posted May 6, 2026
Full Time
About the Company
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future.
Job Description
Discrete and Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development. Key person responsible to align processes between R&D and Manufacturing.
Requirements
- End of Line process development and enabling technology for molded package
- Technical Leadership on End of Line Process
- Supporting quality issue during production
Benefits
- 401k Matching
- Retirement Plan