ENGR STAFF, PACKAGE DEV; PKG&ASSY
onsemiSeremban, Negeri Sembilan, Malaysia
Posted May 14, 2026
Full Time
About the Company
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Job Description
This job requires a full-time Staff engineer with strong engineering knowledge and skills in wire bond equipment and process for early engagement in technical problem-solving, cross-site collaboration to support NPD qualification and high-volume manufacturing (HVM).
Requirements
- Strong engineering knowledge and skills in wire bond equipment and process
- Lead the development, optimization, and qualification of wirebond processes for new and existing semiconductor packages
- Good knowledge in Six Sigma methodology and the DMAIC approach
- Practice good quality system and production control
- Strong communication with team for technical issue and problem solving
- Provide the improvement timeline with RCCA definition
Benefits
- https://www.onsemi.com/careers/career-benefits
