Senior Packaging Engineer
Power IntegrationsMalaysia
Posted February 23, 2026
Full Time
About the Company
Power Integrations is a Silicon Valley-based supplier of high-performance electronic components for power-conversion systems. The company specializes in integrated circuits and diodes that enable energy-efficient AC-DC power supplies for various electronic products, including mobile devices and appliances. Power Integrations' SCALE™ IGBT drivers further enhance efficiency in industrial applications like motor drives and renewable energy systems. With EcoSmart® technology, the company has prevented billions of dollars' worth of energy waste and millions of tons of carbon emissions, making its stock a member of clean-technology indices.
Job Description
We’re hiring a hands-on Resident Package Engineer to support mass production of multi-die wirebond leadframe packages, focusing on sustaining manufacturing performance, supplier process control, and robust release-to-manufacturing protocols.
Requirements
- Act as the on-site technical owner at the OSAT for all packaging activity;
- Support and troubleshoot day-to-day production issues;
- Implement and maintain RTM artifacts;
- Drive process control and SPC;
- Oversee supplier change control and PCNs;
- Participate in supplier audits and periodic process/quality audits;
- Run process characterization and DOE;
- Coordinate failure analysis and disposition of discrepant material;
- Work with NPI and sustaining teams to transfer new or revised processes;
- Report KPIs weekly;
- B.S. in Electrical, Mechanical, Materials, Chemical engineering or related discipline;
- Minimum 2 years’ experience in semiconductor back-end assembly;
- Strong practical knowledge of wirebond processes;
- Strong problem solving using 8-D, FMEA, DOE, SPC;
- Experience with QC/FA tools;
- Excellent communication skills;
- Willingness to be based full-time at the OSAT site with occasional travel
Benefits
- Competitive salary
- Health insurance
- Retirement plan
- Paid time off
