Senior Manager, Engineering (SAW Wafer Level Packaging)

Skyworks is seeking a Wafer Level Packaging Technology Development Senior Manager to lead our team in driving technological advancements, push the boundaries of our technology and improve the overall SAW Development Organization within the SAW Filter New Product / New Technology Group.

Requirements

• M.S. or Ph.D. in Engineering, Material Science, Physics, RF Engineering
• Minimum of 8 years of experience in Technology Development or Integration including following processes: Lithography, Polymer Patterning, Wafer Bonding, Solder Plating, Laser/Plasma Dicing
• Knowledge in Material properties and modelling (Ansys, FEM)
• Excellent leadership, communication with interpersonal skills and used to work in a multi-cultural environment
• Experience in SAW/BAW Technology Development and manufacturing
• Knowledge in Project Management
• Strong analytical and problem-solving skills, both technical and interpersonal
• Pragmatic and flexible attitude with a result- and data-driven can-do mentality
• Works autonomously, well-organized, with a good attention to detail, while setting high standards in all aspects of the work

Benefits

• Salary
• 昇給:年1回
• 賞与:年1回(業績により変動)
• 交通費(会社規定に基づき支給)
• 社会保険(健康保険・厚生年金保険・労災保険・雇用保険)
• 確定拠出型年金制度
• 財形貯蓄・社員持株会
• 転居補助制度(入社時に転居が必要な場合のみ、会社規定に基づき支給)
• 慶弔休暇・弔慰金・各種見舞金制度