Wire Bonding Technician

Join Teledyne Imaging Sensors as a Wire Bonding Technician and be part of a team that values technical excellence, collaboration, and agility. Perform wire bonding of Focal Plane Arrays (FPA) and silicon readout devices, inspect and evaluate parts, and frequently work with ERP system for tracking and reporting of data.

Requirements

• High School Diploma or equivalent with three (3) to five (5) years of experience
• Experience using and setting up manual ball and wedge bonding and automatic wire bonders
• Ability to work under a microscope with good hand-eye coordination

Benefits

• Health, Dental, Vision, and Life Insurance from Day 1
• Paid Vacation, Sick Time, and Holidays
• 401(k) with Company Match
• Employee Stock Purchase Plan
• Educational Tuition Reimbursement