Engineer, Semi Packaging Engineering

Engineer, Semi Packaging Engineering at Analog Devices, Inc., a global semiconductor leader that bridges the physical and digital worlds. Job duties include new product introduction, business unit communications, assembly subcontractor/OSATs communications, cross functional team collaborations, project management, package bill of material selection, package design rules, package model and drawing creation, and package process development.

Requirements

• Master’s degree in Mechanical Engineering, Materials Science and Engineering, Chemical Engineering, Applied Physics, or Electrical Engineering
• 1-5 years of industrial working experience in related fields
• Knowledge in various packaging technologies, process flow, material, qualification, and manufacturing implementation
• Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc.

Benefits

• Medical coverage
• Vision coverage
• Dental coverage
• 401k
• Paid vacation
• Holidays
• Sick time