Analog Devices, Inc. is seeking a Senior Engineer, Semi Packaging Engineering to work on advanced integrated circuit packaging solutions, requiring a Master's degree in a relevant field and 2 years of experience as a Packaging Engineer.
Requirements
- Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or related field
- Two (2) years of experience as a Packaging Engineer or related occupation conceptualizing and productizing semiconductor devices
- Demonstrated expertise in 3D CAD tools (SolidWorks) and FEA software ANSYS
- Demonstrated expertise in IC package design, optimization, and manufacturing
- Demonstrated expertise in IC package reliability requirements, failure analysis techniques, or assembly process issues
- Demonstrated expertise in manufacturing control plan, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of experiment (DOE)
- Demonstrated expertise in CAD tools such as Autocad
Benefits
- Medical, vision and dental coverage
- 401k
- Paid vacation
- Holidays
- Sick time
- Discretionary performance-based bonus