Advanced Packaging Integration Engineer

We are a global leader in materials engineering solutions. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips. As a Process Engineer, you'll design and optimize manufacturing processes for display and semiconductor manufacturing technologies.

Requirements

• Domain expertise in advanced packaging areas such as W2W/D2W bonding, micro bumps, TSV, thermal management, optics and multi-wafer stacking with deep understanding of materials, process, device physics and integration.
• Ability to drive new materials and process development to enable new inflections in logic, DRAM and NAND through structured problem-solving methodology.
• Proven track record of solving complex problems through innovation and ideation of novel approaches.
• Ability to define and develop differentiated modules by leveraging Applied’s broad portfolio of tools.
• Thought leader to define and maintain Applied’s roadmap in hybrid and fusion bonding for emerging device architectures

Benefits

• Generous Paid Time Off
• 401k Matching
• Retirement Plan
• Visa Sponsorship
• Four Day Work Week
• Generous Parental Leave
• Tuition Reimbursement
• Relocation Assistance