Process Integration Engineer

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. The company is seeking a Process Integration Engineer to develop new modules in Advanced Semiconductor Packaging. The successful candidate will be responsible for developing new modules, leading cross-functional projects, and representing Integration Module Solutions as a module specialist.

Requirements

• Developing new modules leveraging Applied’s wide equipment portfolio
• File for IP on new patentable developments
• Domain expertise in advanced packaging areas such as W2W/D2W bonding, micro bumps, TSV, thermal management, optics and multi-wafer stacking
• Ability to drive new materials and process development to enable new inflections in logic, DRAM and NAND
• Proven track record of solving complex problems through innovation and ideation of novel approaches
• Act as engineering expert in semiconductor packaging and help drive cross functional projects
• Help structure and maintain Applied’s roadmap in Packaging modules and how it fits within advanced modules with the industry
• Help design experiments to help improve packaging wiring to improve performance
• Define engineering plans, design DOEs, help characterize and create engineering reports for advanced packaging
• Create roadmap committees for some packaging applications and help shepherd Applied’s product portfolio

Benefits

• Generous Paid Time Off
• 401k Matching
• Retirement Plan
• Relocation Assistance