R&D Process Engineer (Etch Packaging)

Design, collect data, analyze and compile reports on a wide range of complex process engineering experiments for multiple products, utilizing techniques to characterize hardware and generate internal and external documentation for products. Develop, plan and execute process engineering projects, training engineers in measurement techniques of film properties and resolving complex process engineering issues/problems for multiple products.

Requirements

• PhD or Master or Bachelor in Materials Science, Chemical Engineering, Chemistry or Physics or related field
• At least 2 years of relevant experiences in semiconductor including Plasma Etch process development field
• Good communication and interpersonal skills
• Problem-solver attitude with determination and quality-mindset

Benefits

• Generous Paid Time Off
• 401k Matching
• Retirement Plan
• Visa Sponsorship
• Four Day Work Week
• Generous Parental Leave
• Tuition Reimbursement
• Relocation Assistance