Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.
Requirements
- Overall design responsibility for ASIC package designs
- Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
- Schedule, prioritize, & track your work across 2+ projects simultaneously
- Project management and customer interface for your design projects
- Contribute to efficiency improvements for the design team
- Physical design (layout) is a foundational responsibility in this role
Benefits
- Medical
- dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- company paid holidays
- paid sick leave
- vacation time