Advanced Package Technology Engineer

As part of WW ASIC product development team, the Advanced Package Technology Engineer will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers to develop cost effective high performance, advanced custom package solutions.

Requirements

• Master's Degree in Mechanical / Electrical / Electronics Engineering
• 6+ years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution
• 4~6 years Hands On experience in 2.5D / 3D Development
• Sound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies
• Project management, analytical, problem-solving and interpersonal skills
• Ability to develop concepts into structured projects, generate new and innovative solutions to complex problems
• Hands-on experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools
• Sound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes

Benefits

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidays
• paid sick leave and vacation time