As a Chip Assembly Process Engineer, you will support semiconductor assembly processes with a focus on wire bonding and die bonding technologies.
Requirements
- Bachelor’s or Master’s degree in Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, Mechatronics, or a related field.
- 1–3 years of hands-on experience in wire bonding or semiconductor assembly.
- Solid understanding of manufacturing processes and quality control
- Understanding of SPC and DoE; Lean Six Sigma belt is a plus
Benefits
- Competitive compensation program