Chip Assembly Process Engineer (m/f/d) - 100%

As a Chip Assembly Process Engineer, you will support semiconductor assembly processes with a focus on wire bonding and die bonding technologies. You will work closely with production and R&D teams to optimize manufacturing processes, investigate process issues, and drive continuous improvements in process stability, yield, and manufacturing efficiency.

Requirements

• Process ownership over chip assembly processes (die bonding, wire bonding, curing, marking, and inspection)
• Coordinate external wire bonding equipment service providers and oversee internal preventive maintenance activities to ensure optimal wire bonder performance, uptime, and process stability
• Manage wire bonding spare parts inventory and ensure tooling readiness to maintain continuous production and minimize downtime
• Drive continuous improvements of product performance, process control, yield, and cost efficiency
• Analyze and document results and share findings and information with stakeholders
• Develop and implement new processes in collaboration with R&D
• Prepare and maintain work instructions and train operators and engineers
• Coordinate and support maintenance and unscheduled equipment repairs, daily troubleshooting
• Engage with tool suppliers to address process requirements, evaluate upgrades or new equipment solutions, and qualify them for production