IC Package Engineer

Etched is seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work, including collaboration with internal teams and external vendors to deliver optimized, manufacturable solutions.

Requirements

• Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, or related discipline
• 5+ years of experience in advanced IC package design, including CoWoS or equivalent technologies
• Proven experience in substrate layout and BGA package design for large ball arrays (>4000 balls) with >20Ghz signaling and >500W
• Strong understanding of stiffener design, open vs. closed package requirements, and package warpage and coplanarity challenges across various sizes
• Proficiency in package design tools such as Cadence APD/SIP, Mentor Xpedition, or similar
• Familiarity with mechanical stress analysis, simulation, and validation methodologies
• Solid communication skills to work across multi-disciplinary teams and external partners

Benefits

• Full medical, dental, and vision packages
• Housing subsidy of $2,000/month for those living within walking distance of the office
• Daily lunch and dinner in our office