Senior IC Packaging Designer

We are seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. The position requires designing and optimizing package architectures that support high-frequency performance, thermal efficiency, and manufacturability.

Requirements

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
• 3-5 years of experience designing advanced RFIC semiconductor packages up to 50GHz.
• Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging.

Benefits

• Competitive Salary
• Equity Package
• Comprehensive Health, Dental, and Vision Insurance
• 401(k) Retirement Plan
• Paid Time Off (PTO) and Sick Leave