Wissenschaftliche Mitarbeit im Bereich Interconnect Technologies (all genders)

Innovative technology solutions are developed and applied at the Fraunhofer Institute for Photonic Microsystems IPMS. The group 'Interconnect Technologies' focuses on technologies for metallization in the BEOL of CMOS production as well as the boundary area to Advanced Packaging. You will bring about change in the field of Interconnect Technologies, BEOL process integration, and scientific supervision of existing CMP processes.

Requirements

• Abgeschlossenes wissenschaftliches Hochschulstudium (Master/Diplom) in der Fachrichtung Mikroelektronik, Materialwissenschaften, Elektrotechnik, Physik oder einer vergleichbaren Fachrichtung
• Bisherige Berufserfahrung von drei bis fünf Jahren oder eine abgeschlossene Promotion
• Know-how in the area of semiconductor manufacturing technologies, especially in BEOL or BE, preferably on HVM production platforms
• Experience in project management; ideally with responsibility for acquiring publicly funded projects and direct industry orders
• Knowledge of common analysis and measurement methods
• Independent and proactive working style with a focus on reliability and precision
• Strong communication skills with good German (B-level) and very good English (C-level) knowledge

Benefits

• Wertschätzung and trust are the foundation for satisfaction and motivation
• We value intensive induction and an open and collegiate corporate culture
• Whether sports, music or team events - we offer various opportunities to pursue one's own passion and strengthen teamwork
• Attractive and international work environment in an innovative future-oriented industry
• Comprehensive and diverse further education and qualification offer
• Work-life balance through flexible working hours and the possibility of mobile work
• Occupational old-age provision
• Job ticket for public transportation
• 30 days of annual leave
• Corporate benefits