Advanced IC Packaging Software Engineer

As an Advanced IC Packaging Software Engineer at Intel, you will work with customers on advanced packaging technologies, define, develop, and implement design tools, and utilize software development methodologies to design and develop algorithms, software tools, and systems.

Requirements

• Self-driven and results-oriented
• Analytical problem-solving skills
• Effective communication skills
• Experience with C/C++ with STL and Boost libraries
• Data structures and algorithms
• Computational Geometry
• Experience with EDA Tools
• Software design and architecture
• Scripting experience in tcl, Python, SKILL, VBScript, or Perl
• Understanding of AI and ML fundamentals
• Experience with Agile and Scrum development practices

Benefits

• Competitive pay
• Stock bonuses
• Health benefits
• Retirement benefits
• Vacation benefits