Advanced Packaging Module Development Engineer

Join Intel's Advanced Packaging Technology Development team as an Advanced Packaging Research and Development Engineer where you will drive innovation and help shape the future of advanced IC packaging solutions. In this role, you will be responsible for process and equipment development at the module level, driving solutions that meet Intel’s stringent requirements for quality, reliability, yield, cost, and productivity.

Requirements

• Develop and optimize panel level processes and equipment to support Intel's advanced packaging technologies.
• Establish process specifications and equipment configurations for new technologies and integrate these into production workflows.
• Apply principles of design of experiments (DoE) to characterize process windows and understand interactions between equipment, materials, and processes.
• Drive continuous improvements in process capability, quality, reliability, cost, and yield while enhancing automation and productivity.
• Collaborate with cross-functional teams to identify and mitigate risks in packaging technology development and ensure milestone achievement.
• Lead efforts to innovate and improve equipment and processes using statistical methods and experimental design.
• Document process improvements and advancements through technical white papers and data analysis reports.
• Engage with internal and external stakeholders to address packaging challenges and deliver solutions aligned with Intel's goals.

Benefits

• Competitive pay
• Stock bonuses
• Health benefits
• Retirement benefits
• Vacation benefits