Packaging Module Equipment Development Engineer

The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by developing and innovating packaging solutions, collaborating with teams, and managing projects to meet product development timelines.

Requirements

• Develop First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies
• Collaborate with multifunctional and cross-organizational teams
• Innovate next generation equipment, materials, and fabrication processes
• Manage projects to meet product development timelines
• Provide sustaining support for equipment performance and process health
• Respond promptly to foundry customer requests and events

Benefits

• Competitive pay
• Stock bonuses
• Health benefit programs
• Retirement benefit programs
• Vacation benefit programs