Packaging Module Development Engineer
Intel CorporationPhoenix, Arizona, United States
Posted April 10, 2026
133800 - 219550 USD
Full Time
About the Company
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers.
Job Description
The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by developing interconnect and thermal interface solutions, collaborating with teams, innovating materials and equipment, and managing projects.
Requirements
- PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related field
- Minimum GPA of 3.5
- At least three publications in a peer-reviewed technical journal
- One or more years of experience in technology development, semiconductor fabrication processes, and/or previous related work experience in a semiconductor foundry
- Ability to coach and develop technical teams
- Technical leadership, strategic planning, and critical thinking
- Strong communication, influencing, technical, and analytical skills
Benefits
- Competitive pay
- Stock bonuses
- Health benefits
- Retirement benefits
- Vacation benefits