Packaging Module Development Engineer
Intel CorporationPhoenix, Arizona, United States
Posted March 31, 2026
155520 - 255200 USD
Full Time
About the Company
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers.
Job Description
The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by providing mechanical modeling support for R&D projects, working with Equipment and Process Engineers to define problem statements, and keeping up with the latest development in computational mechanics field.
Requirements
- Ph.D. degree in Applied Mechanics, Mechanical Engineering, Aerospace Engineering, Civil Engineering, or related Stem field.
- 8+ years of experience in computational mechanics.
- 8+ years of experience with commercial FEA software (Ansys / Abaqus).
Benefits
- Competitive pay
- Stock bonuses
- Health benefits
- Retirement benefits
- Vacation benefits